| 摘要 |
PURPOSE:To obtain a low impedance probe card suitable for use in a probe test for a very high speed LSI and the like by a method wherein a surface of a glass epoxy print board is made thinner and a belt shaped thick Cu plate is buried therein with a probe pin fixed to an end thereof by solder. CONSTITUTION:A recess is provided at an end of a print board 2 composed of glass epoxy or the like and a belt shaped approximately 0.8mum thick Cu plate 1 is buried therein. An end of the Cu belt is provided with a probe pin 4 soldered tight thereto for the formation of a probe card. The pin tip is abutted with a semiconductor wafer to determine various electric chracteristics. This card is of low impedance and erroneous measurements can be eliminated. |
