| 摘要 |
PURPOSE:To remove a resin burr without applying a protecting mask on the resin mold layer by employing a mixture of thermosetting resin particles and glass beads as a grinding agent in the wet-honing method. CONSTITUTION:When forming a resin mold layer 1, the resin leaking out of a molding chamber adheres on the surface of outer leads 3, whereby resin burrs 6 are produced thereon. The resin burrs 6 are removed by spraying water containing a grinding agent on a resin-sealed semiconductor element from a jet nozzle. At this time, a mixture dualistically comprising thermosetting resin particles and glass beads at a composite ratio of approximately 1:1 is employed as a grinding agent. In the case of adding the grinding agent, for example, 2 parts of thermosetting resin particles and one part of glass beads by weight ratio are mixed together. |
