| 摘要 |
<p>In a semiconductor circuit device in which semiconductor circuit elements are mounted on the mounting portion of a lead frame, a power-source lead and a grounding lead are improved so that the individual leads will have decreased common inductances, in order to improve electric characteristics of the device. A support member of the mounting member has an increased width to form a power-source lead, and provision is made of a grounding lead with a plurality of branches to decrease the common inductance. Further, one of the support members of the mounting member is coupled to a neighboring lead member to form a grounding lead which has a plurality of branches, in order to decrease the common inductance of the grounding lead. Moreover, provision is made of a power-source lead having a plurality of branches and of a grounding lead having a plurality of branches to decrease common inductances of the two leads.</p> |
