发明名称 FORMING METHOD FOR PLANE MULTIPLE-WOUND COIL
摘要 PURPOSE:To reduce the forming processes of the plane multiple-wound coil, and to manufacture the coil easily by forming a plural pair of the first approximately U-shaped conductive layers with different length in the same direction while being mutually separated and shaping a plural pair of the second conductive layers mutually connecting the conductive layers in the same direction while being separated. CONSTITUTION:The thin-film patterns of the conductive layers and insulating layers are formd through masks, and the plane multiple-wound coil is shaped. When molding the multiple-wound coil, the first approximately U-shaped conductive layers 13-1-13-6 with different length are formed to the first insulating layer 15 of a substrate 4 in the same direction while being mutually separated. A plural pair of the second conductive layers 14-1-14-6 mutually connecting the conductive layers 13-1-13-6 are shaped in the same direction as the second insulating layers 16 while being mutually separated. The conductive layers 13-1- 13-6 are each connected to terminals 11, 12, the forming processes of the plane multiple-wound coil are reduced, and the multiple-wound coil is easily manufactured.
申请公布号 JPS58113(A) 申请公布日期 1983.01.05
申请号 JP19810098571 申请日期 1981.06.25
申请人 FUJITSU KK 发明人 SAWADA SHIGETOMO;TAKAGI HITOSHI;TAKAHASHI YOSHIO
分类号 H05K1/16;H01F17/00;H01F41/04 主分类号 H05K1/16
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