发明名称 SEMICONDUCTOR WAFER HANDLING METHOD
摘要 PURPOSE:To improve workability of scribe action or property check, by a method wherein a projection of semiconductor wafer is enclosed in a relief portion of a supporter, flat portion is received on the supporter, and the wafer is held at normal attitude. CONSTITUTION:Flat portions 8 are formed at the center and a periphery of a wafer 1 with surface having projections 2. Upper surface of a working stage 6 (supporter) is provided with a relief portion 9 which corresponds to position of the projections 2 and enclose them, and suction hole 10 is provided on a support surface 6a of the flat portion 8. Otherwise, electron wax 4 may be applied to the flat portion, the projection 2 may be enclosed within a relief portion 11, and the flat portion 8 may be applied to a support surface 5a of a reinforcing plate 5. In this constitution, the wafer is supported on the supporter to hold parallelness and flatness, thereby workability is improved during scribe action and property inspection.
申请公布号 JPS58146(A) 申请公布日期 1983.01.05
申请号 JP19810098814 申请日期 1981.06.25
申请人 NIPPON DENKI KK 发明人 NOZAKI JIYOUSUKE
分类号 H01L21/301;H01L21/683 主分类号 H01L21/301
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