| 摘要 |
PURPOSE:To conduct bonding, strength thereof is stable, by adding the detection of the quantities of crush and deformation to the control of a bonding cycle. CONSTITUTION:The nose of a tool 11, an inner lead 10 and the bumps 6 of a semiconductor element 1 are positioned, a bonding head 20 is dropped and the contact (an origin) of the nose and the lead 10 is detected 22. When the head 20 is further dropped, a pressing section 21 is not dropped, only a main body is dropped, and output potential 23 is detected 22. When the potential 23 reaches one set, heating is started and thermocompression bonding is started. Only the pressing section 21 is dropped through the deformation of the bonding section, and the output potential changes. The potential difference corresponds to the quantity of crush, when the output potential reaches one 24 set is detected 22, the head 20 is lifted and bonding is completed. According to this constitution, bonding, strength thereof is stable, can be conducted because the quantities of crush and deformation are detected when bonding operation. |
