| 摘要 |
A highly compact rectifier unit constituted by a sub-assembly potted within an insulating case having a metal base plate of high thermal conductivity to provide a heat sink for dissipating heat generated by the sub-assembly to enhance the current rating and to reduce the thermal impedance of the unit. The inner face of the base plate is porcelainized to form a thin insulating film thereon electrically isolating the sub-assembly from the plate. The surface of the insulating film is metallized to define separated metallic zones thereon which make contact with correspondingly-positioned conductive base straps of the sub-assembly to create a thermal bridge between the sub-assembly and the base plate.
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