发明名称 Process and apparatus for etching through-holes in glass sheets
摘要 A combined immersion/spraying process for the production, preferably, of X-ray masks, by glass etching using hydrofluoric acid. The etching section selected is to be removed completely evenly and without residues. According to the invention, the mask to be etched is immersed into an etching cassette in hydrofluoric acid, and the etching section is sprayed with hydrofluoric acid by means of a spray head. An opening in a side wall which corresponds to the area of the through-hole to be etched is provided in the etching cassette.
申请公布号 DE3122544(A1) 申请公布日期 1982.12.30
申请号 DE19813122544 申请日期 1981.06.05
申请人 SIEMENS AG 发明人 WOLFF,HANS-GEORG
分类号 C03C15/00;G03F1/14;G03F1/22;(IPC1-7):C03C15/00;G03F7/02 主分类号 C03C15/00
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