| 摘要 |
PURPOSE:To enhance the sensitivity of a heat-resistant photosensitive material, by using a composition consisting of a specified polyamic acid and a specified amine compound. CONSTITUTION:A composition consisting of a polymer composed mainly of a polyamic acid having repeating units represented by general formula (I) and being the precursor of polyimide, and an amine compound represented by general formula (II), and when needed, a sensitizer is used by dissolving it in an organic solvent. This solution is coated on a substrate, irradiated with UV rays, and the unexposed part is dissolved off with a developing solution to give a relief pattern. It is cleaned with a rinsing solution to remove the developing solution. The polymer of the relief pattern obtained by this process is the precursor of a polyimide, and it is converted into the relief pattern of a heat-resistant polymer having imide rings or other cyclic groups by processing it at the heating temp. of 150-450 deg.C. In formula (I), R<1> is a tri- or tetra-valent organic group, R<2> is a divalent organic group; M is H, alkali metal ion or ammonium ion, and n is 1 or 2. In formula (II), Ar is an aromatic group consisting of >=2 benzene rings or a hetero ring; X is N3- or N3SO2-; Y is a monovalent group selected from H, alkyl, alkoxy, nitro, carboxy, sulfo, and halogen; R<3> a divalent organic group linking Ar and N; and R<4> and R<5> are each H or lower alkyl. |
