| 摘要 |
The manufacturing process to fabricate a mold type transistor is done as follows. The conduction part is made on the connecting electrode interlinked semiconductor and metal lead. Metal thin film cut a certain size is adhered to the conduction part. The feature of this invention is to make a high quality semiconductor apparatus (1) is a lead frame, (5) is a transistor plate. The size of conduction part (la), (lb), (lc) is changed in the range of having nothing to do with the characteristic of mold type transistor.
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