发明名称 BONDING
摘要 PURPOSE:To perform bonding by one time positioning by a method wherein coordinate data of pellets of the plural number and/or individual pellets on a substrate are compared with the reference values to be corrected. CONSTITUTION:The positions of the respective pellets 1A-1D and bonding pads of the respective pellets are recognized 12 by an optical system 10 having a TV camera. The reference values of the positions of the pellets and of coordinates of the pads are decided in relation to a positioning pin 3, and are stored in a floppy disc 14. The stored informations in the disc 14 are loaded in a memory of a microcomputer 16 to be compared with the recognized 12 values, discrepancies are calculated to be corrected 16, and the positins of the boding pads can be obtained. By controlling 18 and X-Y table of a bonder 20 according to thus obtained results, wires 4 can be bonded automatically and surely with favorable efficiency at the desired positions.
申请公布号 JPS57211242(A) 申请公布日期 1982.12.25
申请号 JP19810095353 申请日期 1981.06.22
申请人 HITACHI SEISAKUSHO KK;HITACHI OUME DENSHI KK 发明人 YAMAZAKI ISAMU;WATANABE KENJI;KIYOUMASU RIYUUICHI;ISHII YASUSHI
分类号 H01L21/52;H01L21/60 主分类号 H01L21/52
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