发明名称 ELECTRONIC PARTS
摘要 PURPOSE:To form an inexpensive electronic parts with surface fitting type structure by a method wherein an electric circuit element is held at between the end surfaces of a pair of lead wires to hermetrically seal the element by a glass tube and solder is adhered to the lead ends at the opposite ends of the tube and the ends of the tube to form electrode sections. CONSTITUTION:A lead wire 2 and a stud 1 are inserted in a glass tube 4. Then, an electric circuit element 3, the stud 1, and lead wire 2 are successively inserted in the tube 4 to melt the tube 4 for sealing and solder 15 is adhered to the opposite end sides of the tube 4. Next, the lead wires 2 projected from a sealing section 9 are cut at around the base to form electrode sections 16 by the solder 15.
申请公布号 JPS57211760(A) 申请公布日期 1982.12.25
申请号 JP19810096659 申请日期 1981.06.24
申请人 HITACHI SEISAKUSHO KK 发明人 SAITOU TOSHINAO
分类号 H05K1/18;H01L23/051;H01L23/48 主分类号 H05K1/18
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