| 摘要 |
<p>PURPOSE:To obtain a satisfactory cooling effect without giving concentrated stress by a method wherein a plurality of rigid body plates are provided at the position of the chips to be cooled on the bottom face of the bag-shaped container in which liquid type refrigerant was sealed, and these plates are contacted to the back side of the chips respectively. CONSTITUTION:The container 5 is a bag consisting of two superposed soft sheets, the circumference of which was sealed, a copper plate 7 is adhered to one side of the container corresponding to the chips, and a copper pipe 8 is arranged in the bag making a zigzag line. The circumference of the container 5 is pinched between Al frames 11 and 12 and tightened using a bolt 13, and the container 5 is covered from above a substrate 1. An appropriate quantity of pure water 6 is filled in the container, the container is sealed, and when the above is maintained in a freely deformable state, the container 5 hangs down due to the weight of the pure water 6 and comes in contact with the chips, to which the copper plate 7 is corresponding, uniformly and gaplessly under the prescribed pressure, thereby enabling to eliminate the concentrated stress and to maintain the thermal resistance at sufficiently low level. As a result, satisfactory cooling effect can be obtained without characteristic deterioration and breakdown on the semiconductor device.</p> |
