| 摘要 |
PURPOSE:To reduce the size of a hybrid integrated circuit module and to improve the reliability of the module by forming an insulating layer which places electronic parts on the bottom plate of the module and filling resin from upper hole in an enclosure. CONSTITUTION:An insulating substrate 25 which places electronic parts such as resistors or the like is formed on a bottom plate 24 to become a radiator, a case having filling holes 22 is disposed on the upper surface, sealing resin 23 is filled through the holes 22 into the case, and the case 21 is bonded to the bottom plate 24. Since a frame mounting space becomes unnecessary in this case, the size of a produce profile can be reduced, and the reliability can be improved. |
