| 摘要 |
PURPOSE:To reduce the manufacturing cost of a semiconductor device and to maintain the reliability of the device preferable by employing a copper wire or an Ni wire covered with solder as a bonding wire. CONSTITUTION:When a semiconductor element 3 which is mounted with solder 2 on a tab 1 is connected to external wires 4, copper wires or Ni wires covered with solder are used as bonding wires 5, and they are molded with resin 6. In this manner, the wires become inexpensive, improper disconnection of the wire due to corrosion can be prevented, and the reliability of the element can be enhanced. |
