| 摘要 |
PURPOSE:To keep a joining area constant, to relax stress applied to a semiconductor element and to prevent the inclination and floating of the semiconductor element by forming a joining section having a surface area smaller than the semiconductor element to a semiconductor-element base section and cementing the semiconductor element and the semiconductor-element base section by a cementing material placed on the joining section. CONSTITUTION:A joining section 6 shaped by a recessed through-hole 8 and having a surface area smaller than that of a contacting semiconductor element 1 and a connecting section 7 connecting the joining section 6 and a semiconductor-element base section 2 body are formed to the semiconductor-element base section 2, and the semiconductor element l and the semiconductor element base section 2 are cemented by a cementing material 3 placed on the joining section 6. The surface area of said joining section 6 is brought to a value such as 4X4mm<2> or less. Accordingly, the joining area of the semiconductor element and the semiconductor element base section can be kept constant, stress generated in the semiconductor element due to the difference of thermal expansion coefficients can be relaxed, and the semiconductor element is supported even by the semiconductor-element base section body, thus preventing an inclination and floating to the semiconductor-element base section of the semiconductor element.
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