| 摘要 |
PURPOSE:To make wide the area of a region where constituent elements are usable though the area is of the same size as that of a chip and to improve an integration degree by a method wherein the constituent elements are arranged on a semiconductor substrate just under bonding pads as well. CONSTITUTION:Constituent elements are arranged on a semiconductor substrate just under bonding pads as well. That is, as the constituent elements are arranged at all the regions of a master slice IC expecting a scribing region, elements located at the regions of bonding pads 2, which are not actually used for a bonding, can be also used for the circuit constitution of the IC. In such a way, by arranging elements such as transistors, resistors and capacitors on the semiconductor substrate just under the bonding pads as well in the IC, in particular in case basic master chips are combined a plurality of groups and one large master slice chip is constituted, the area of a region usable for the constituent elements can be made large and an integration degree can be improved. |
