An adhesive 2 is coated on a base member 1, and metal piles 3 are electrically embedded in the adhesive coating 2 with a high voltage applied between upper and lower plate electrodes 6 and 7. Subsequently, a powdery solder 8 is sprayer over the temporarily embedded metal piles 3 and is thermally fused to secure the metal piles 3 to the base member 1. <IMAGE>
