| 摘要 |
A method of interconnecting circuit components in a semiconductor integrated circuit including component elements formed in the substrate and thin-film resistors and capacitors formed on a surface of the substrate, a molybdenum plug is utilized to facilitate stable, uniform low resistance contacts to circuit elements, molybdenum (moly) plugs are utilized as a barrier between interconnect metallization and the circuit components. A CLAD moly/aluminum metallization interconnect can be fabricated in a standard process in which the moly plugs are formed. The accuracy and stability of thin-film resistors is facilitated during wafer processing, laser trimming, temperature cycling, and assembly processing thereby providing repeatable matching by eliminating contact resistance as a process variable.
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