| 摘要 |
PURPOSE:To shorten the assembling process of a device, and to make the device proper to mass production by a method wherein a color resolving filter and metallic wiring surrounding the filter are formed to one surface of a transparent board while being opposed to the light receiving region of an solid state image pickup device, the side is arranged at the device side and the filter is bonded to the light receiving region and a wire to a pad shaped to the device. CONSTITUTION:A large number of the color resolving filters 120 are formed to one surface of the transparent board 100 consisting of ribbon-shaped plastic having flexibility, and the predetermined metallic wiring 110 are shaped at each filter 120 side while surrounding these filters. The light receiving region 150 of a solid state image pickup device 140 is bonded to the filter 120 while being positioned by using lens bond 160, and the metallic wiring 110 is bonded to the pad 170 formed around the light receiving region 150. Accordingly, the process in which the filters are bonded to the device and the process in which the wiring is bonded by wires can be executed by the same process, and a manufacturing process is simplified. |
