| 摘要 |
PURPOSE:To obtain a chip alley system device at a low cost, by mounting a semiconductor chip with the arrangement of common wiring pads along the edge in X direction on a package provided with common wirings in band along X direction to connect the two each other. CONSTITUTION:Common wiring pads 1 for common power sources, etc. are arranged on the edge in X direction of the IC chip 2 and wiring pads 3 for discrete signals for every chip on the edge in Y direction. A ceramic frame 7 is fused by glass on a ceramic substrate 5 having a concave part 4 to provide a plurality of metallized common wirings 8 on the upper surface of the substrate 5 including the concave part. One end of the wiring 8 is extended out to the end surface in X direction with the opposed arrangement of discrete wirings 9 of the same quality on the both sides of the concave part to extend one end out to the end surface in X direction. A ceramic base 10 is fused by glass on the concave part 4 with external leads soldered on the end surface part of the substrate 5 of terminals 8, 9. The chip 2 is adhered on the base 10 by resin to connect 14 as required thereafter to seal by a ceramic lid 13 for completion. In this constitution of a chip and package, a device with high mounting density is obtained at a low cost. |
