发明名称 SPUTTERING DEVICE
摘要 PURPOSE:To form thin alloy films of desired compsns. uniformly by denting the surfaces of a sputtering electrode wherein plural metallic pieces are formed to one body to a spherical shape, and connecting electric power sources to each of the plural metallic pieces. CONSTITUTION:A sputtering electrode (target) 1 is made by forming plural dissimilar metallic pieces 2 to one body by means of insulating materials 3 and denting the surfaces thereof to a spherical shape. A material 4 to be vapor deposited is held by means of a jig at a level higher than the spherical center of the spherical dent of said target 1. Each of the dissimilar metallic pieces 2 of the target 1 is connected to electric power sources 5 by means of connecting wires 6, and the respective outputs are controlled. With such mechanism, thin alloy films of arbitrary compsns. are vapor deposited uniformly on the material 4 and the compsns. of the thin alloy films are controlled as desired during vapor deposition.
申请公布号 JPS57207174(A) 申请公布日期 1982.12.18
申请号 JP19810091342 申请日期 1981.06.12
申请人 MATSUSHITA DENKO KK 发明人 MIYANO TAKAHIRO;NAKAJIMA KUNJI;KOYAMA SHIYOUICHI
分类号 C23C14/34 主分类号 C23C14/34
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