| 摘要 |
PURPOSE:To prevent breakage during ball formation by heat treating a bonding wire at a temperature higher than the recystallization temperature. CONSTITUTION:A bonding wire 1 is heat treated beforehand at a temperature higher than the recrystallization temperature so that the changes in crystal grains, tensile strength, hardness and elongation are almost settled and they have been made uniform when a ball 4 is formed. Therefore even if a strain is generated after the bonding, the strain amount is absorbed by the whole of the bonding wire 1 so that there will be no large tension, and breakage will be prevented. |
