| 摘要 |
A single-in-line circuit module which has no housing, can be plugged in vertically, and has a carrier (T), consisting, for example, of plastic film or ceramic for carrying a series of metal pins (M), which are located in the plane of the carrier, as external connections, leads (L) and one or more electrical components, including at least one integrated semiconductor circuit body ("chip") without a housing and a heat sink (cold plate, cooling plate) (KB, KB') which is, for example, metallically earthed, is in each case bonded on a side surface of the carrier (T) such that it at least largely covers said carrier (T) there and is flat in order to save space, namely having no rib and no bent projection. <IMAGE>
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