HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY FOR ELECTRONIC EQUIPMENT EXCELLENT IN THERMAL PEELING RESISTANCE OF SOLDER,申请号JP19900228368-传众专利搜索

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发明名称	HIGH STRENGTH AND HIGH CONDUCTIVITY COPPER ALLOY FOR ELECTRONIC EQUIPMENT EXCELLENT IN THERMAL PEELING RESISTANCE OF SOLDER
摘要
申请公布号	JPH04110429(A)	申请公布日期	1992.04.10
申请号	JP19900228368	申请日期	1990.08.31
申请人	NIPPON MINING CO LTD	发明人	WATANABE HIROAKI
分类号	C22C9/00;C22C9/02;H01L23/50	主分类号	C22C9/00
代理机构		代理人
主权项
地址

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