发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To suppress a power source noise by interposing a high dielectric insulating substance, a metal plate, and a conductive substance in this order between positive and ground side power source pins of a capacitor provided in a package when the pins are penetrated through the package to be drawn externally. CONSTITUTION:When a capacitor is mounted on a package PG made of multilayer ceramics, and positive and ground side electrode pins TH, TG are penetrated through the package PG to be drawn externally, the following is executed. The inner peripheral wall of a viahole 6 which penetrates the package PG is covered with a conductive film 7, the pins TH, TG are contacted with the lower ends, the pin TH is surrounded by a high dielectric insulating substance 2, and the pin TG is surrounded by a conductive substance 1, such as solder. An insulating adhesive 4 made of glass and a copper plate 3 having a pin conduction hole are provided therebetween, the rear surface in which the pins TH, TG are projected is covered with an insulating film 5 made of polyimide to flatten the rear surface.
申请公布号 JPS6377141(A) 申请公布日期 1988.04.07
申请号 JP19860220882 申请日期 1986.09.20
申请人 FUJITSU LTD 发明人 NIKAIDO MASATAKA;HAMANO TOSHIO
分类号 H01L23/12 主分类号 H01L23/12
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