| 摘要 |
To permit direct bonding of a composite electric contact-and-bonding material to a carrier, such as a reed, magnetic strip, or the like, by thermo-electric heating, the side of the contact-and-bonding material is formed with projections, preferably projecting ridges, ribs, or beads, and a bonding or solder material in wire form is adhered, by rolling on to the valley between the projecting ridges, the bonding or soldering material leaving space free between adjacent ridges or ribs and not filling the entire recess, but projecting outwardly at least as far as the projections or ridges, and preferably slightly therebeyond. The soldering or bonding wire may have round or polygonal, preferably triangular cross section with a pointed tip extending outwardly to provide for concentration of heat upon resistance heating the contact material against the carrier strip. |
