发明名称 Adhesive bonding process
摘要 Products are prepared containing a radiation-sensitive reactive material and a saturated polyol. The product is used to bond films either through radiation or free radical initiation. The product is usable for bonding such films as polyester, polyvinylchloride, polyethylene, nylon or acrylonitrile-butadienestyrene copolymers.
申请公布号 US4363689(A) 申请公布日期 1982.12.14
申请号 US19780971611 申请日期 1978.12.20
申请人 HENKEL CORPORATION 发明人 ROESLER, RICHARD R.
分类号 C08J5/12;C09J4/06;(IPC1-7):C09J5/02 主分类号 C08J5/12
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