METHOD AND APPARATUS OF MANUFACTURING HYBRID INTEGRATED CIRCUIT

摘要

A method of manufacturing a hybrid integrated circuit comprises the steps of: a) placing chip-type circuit elements on predetermined portions of a template; b) preparing a printed circuit board having adhesive material at given portions thereof; c) piling the printed circuit board on the template so as to bring the circuit elements into contact with the adhesive material; d) turning the template with the circuit board upside down and then transferring the circuit elements to the circuit board by removing the template from the circuit board; e) hardening the adhesive material to temporarily hold the circuit elements on the circuit board; and f) soldering the circuit elements to conductive patterns formed on the circuit board, so as to electrically connect the circuit elements with the conductive patterns. This method of the present invention is well performed with an element-distributing apparatus which will be below explained in details.