发明名称 HOT BONDING METHOD OF SYNTHETIC RESIN REQUIRING HIGH TEMPERATURE
摘要 PURPOSE:To exactly bond polyester bands without causing cutting by baking by the heater of a packing machine by a method in which the temperature of the heater is temporarily raised to a temperature higher than an optimal temperature during a heater insertion process. CONSTITUTION:A heater 1 is energized to an optimal temperature for the hot- bonding of a synthetic resin requiring high temperatures (where a switch 1 is in the position of the one-dot chain line and primary side coil 2 of a transformer 5 is in a largely turned state), and during a heater insertion process, the switch 7 is switched to the position of full line at an optimal time before and after the heater 1 enters between bands and the number of turns of the primary side coil 2 of the transformer 5 becomes less, whereby the temperature of the heater 1 becomes higher than the optimal temperature and bands in contact are securely bonded with each other. Afterwards, the switch 7 is switched to the one-dot chain line and the optimal temperature for hot bonding is restored for the next hot bonding process.
申请公布号 JPS57203514(A) 申请公布日期 1982.12.13
申请号 JP19810091422 申请日期 1981.06.10
申请人 TAKAMI MASAYASU 发明人 TAKAMI MASAYASU
分类号 B29C53/00;B29C65/00;B29C65/18;B29C65/20;B29C65/30;B65B13/00 主分类号 B29C53/00
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