| 摘要 |
PURPOSE:To obtain high waterproof and dampproof sealing at a plastic package semiconductor device by a method wherein the package to accommodate a semiconductor chip having lead wires is constituted of a pair of plastic package parts forming a tightly seaing cavity, and low melting point glass layers are adhered to the inside faces and the junction parts thereof. CONSTITUTION:A lead frame 11 mounting the semiconductor chip 1 is sealed with the upper part package 3 and the lower part package 4 provided respectively with the concave part at the confronting faces. At this constitution, the upper part package 3 and the lower part package 4 are molded and processed together in a dish type using a plastic material, and continuous low melting point glass layers 31, 41 are provided respectively on the mutually confronting concave parts, on the circumferential walls and on the contact faces thereof. To form the glass layers 31, 41 thereof, a mixture of liquid type, paste type or powder glass and a binder, etc., is used, and are adhered by heating at 120- 130 deg.C in an oven. |
