| 摘要 |
The compound includes: a) from about 5 to 90 % by weight of curable epoxy resin; b) from about 0.01 to 10 % by weight of an aromatic onium salt of the formula: <IMAGE> wherein each R is a monovalent organic aromatic radical; X is selected from the group consisting of sulfur and iodine; C is a Lewis acid polymerization catalyst precursor; a equals the absolute value of the valence number of (X minus 1); and b equals the absolute value of the valence number of C; c) from about 0.01 to 10 % by weight of peroxide compound effective to activate said catalyst; and d) from about 10 to 95 % by weight of filler, based on the total weight of the composition. These molding compounds exhibit both superior curing rates and storage stability. |
