| 摘要 |
PURPOSE:To obtain a protective layer by converting the surface of an aluminum wiring layer into an oxide after completing the bonding. CONSTITUTION:An oxidized film 15 is formed on a semiconductor pellet 14, a desired hole is opened at the film 15, and a wire 11 of aluminum connected to a circuit element in the pellet 14 is pulled above the film 15 through the hole. A metal wire 16 is bonded to the wire 11 of aluminum in this state. Thereafer, it is heat treated in oxidative atmosphere such as steam or ozone to convert it into oxidized aluminum 9 with the surface of the wire 11 as a protective film. |
