| 摘要 |
PURPOSE:To obtain the compact, highly integrated thermopile which is applied in a heat flow sensor and to implement a compact, thin configuration and mass production of the sensor by bonding two metal foils to a resin film, obtaining the required configuration by photoetching, and metallurgically bonding the connecting parts. CONSTITUTION:As two metals for a thermocouple, copper is used in a blank part in the Figure, and constantan is used in a hatched part. Both ends of two filament parts are connected and a series circuit is formed. In manufacturing, the copper and constantan foils are bonded to the resin film, and a required picture pattern is formed by the photoetching. The insides of both parts are put together, and the temperature of the connected part is increased to 260 deg.C by using gold as an intermediate metal. The pressure of 20 atmospheric pressure is applied, and the metallurgical bonding is instantaneously performed. Thus the thermopile 15 is completed. Therefore the compact, highly integrated device can be obtained, and it is applied in the heat flow sensor. The sensor can be made compact and thin, and the mass production can be implemented. |
