| 摘要 |
PURPOSE:To measure the surface temp. of an object to be measured accurately and easily by bringing a semiconductor chip having a p-n junction into contact with said object and detecting the temp. on the surface of the object from the change in the forward voltage thereof. CONSTITUTION:The substrate side of an npn transistor chip 4 is soldered by a solder material 3 to a part of the surface of a transistor case consisting of a cover part 1 contg. therein an npn transistor to be tested and a stem 2. Fine metallic wires 5, 6 are beforehand drawn out from the emitter electrode and base electrode of the chip 4. The change in the forward voltage VEB of the chip 4 is measured continuously, and if the change in this forward voltage is converted to a temp., the accurate surface temp. is measured. |
