发明名称 Method of preventing deformation of lead frames
摘要 Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.
申请公布号 US5475918(A) 申请公布日期 1995.12.19
申请号 US19940307006 申请日期 1994.09.16
申请人 ELECTROPLATING ENGINEERS OF JAPAN LTD. 发明人 KUBOTA, TSUNEO;TANIGUCHI, KAZUHIRO
分类号 C25D5/02;C25D7/00;H01L23/495;H01L23/50;(IPC1-7):H01L21/48 主分类号 C25D5/02
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