发明名称 |
Method of preventing deformation of lead frames |
摘要 |
Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.
|
申请公布号 |
US5475918(A) |
申请公布日期 |
1995.12.19 |
申请号 |
US19940307006 |
申请日期 |
1994.09.16 |
申请人 |
ELECTROPLATING ENGINEERS OF JAPAN LTD. |
发明人 |
KUBOTA, TSUNEO;TANIGUCHI, KAZUHIRO |
分类号 |
C25D5/02;C25D7/00;H01L23/495;H01L23/50;(IPC1-7):H01L21/48 |
主分类号 |
C25D5/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|