Device for cooling freshly-soldered circuit boards

摘要

Electrical circuit boards are cooled immediately after passing through a soldering work station wherein heat-sensitive electrical components are mechanical soldered into such circuit boards so as to minimize dangerous temperature peaks without disrupting the soldering process. The cooling device is positioned closely adjacent to the soldering work station and comprises a housing having a C-shaped passageway along the center thereof for receiving an elongated transport means carrying freshly-soldered circuit boards in a given direction from the solder soldering work station. Air flow means are provided at opposite wall portions of the passageway for directing a stream of cooling air against opposite sides of the circuit boards carried by the transport means and approximately at right angles to the travel directions of such boards.