Contact clip for connecting a ceramic substrate to a printed circuit board

摘要

The present invention relates to a contact clip which may be attached to a ceramic or other type substrate and which may be plugged into a PCB and thereby provide electrical connections between the substrate and the conductive traces on the board. More particularly, the clip includes a receptacle for receiving the edge of a substrate for mechanical retention and electrical contact, a spring arm which protects the substrate from thermal and mechanical stresses, a low force pluggable pin section for insertion into a board's plated-through hole, and means establishing redundant short electrical paths between the pad on the substrate and the traces on the PCB.