发明名称 DETECTION OF WIRE BONDING STATE AND DEVICE THEREFORE
摘要 PURPOSE:To automatically inspect junction state with high speed and high accuracy by a method wherein the maximum diameter of a ball section and the drift amount of the ball and pad from the central spot are obtained by an image pick-up signal under bright field lighting after detecting the pad completed wire junction by the image pick-up signal under bright field lighting. CONSTITUTION:The image pick-up signal of a pellet is fed to an information processing device through a camera under bright field lighting and a pad 5 is detected by collating with a standard pattern S. At that time, the size of the pad and center C1 are calculated. Next, the pad is pictured under bright field lighting and the distance C1X1 can be obtained from a variation in signal level between the D and the center C1 by supposing spot D on the pad 5. The pad is rotated by a predetermined angle in the circumference direction of a ball section 9 with spot C1 as the central figure and the distance C1X2 is also obtained by detecting spot X2 on a collar 9b from a variation in signal level between EC1. The maximum diameter of the ball section 9 and the center C2 are obtained in the same way. The shift amount can be known by comparing the centers C1, C2 and the quality of wire junction can be decided by the shift amount and the size of the ball section 9.
申请公布号 JPS57198638(A) 申请公布日期 1982.12.06
申请号 JP19810083476 申请日期 1981.05.30
申请人 TOKYO SHIBAURA DENKI KK 发明人 GOTOU YUKIHIRO;SUZUKI NOBUKAZU;NAGASHIMA SUMIO
分类号 G01N21/88;G01B11/24;G01N21/956;H01L21/60;H01L21/66 主分类号 G01N21/88
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