| 摘要 |
<p>PURPOSE:To remove defective brazing by tightly attaching silver solder previously onto the brazing surface of the lead pin. CONSTITUTION:The silver solder 2 is tightly attached previously onto at least brazing surface 1a of the lead pin 1 or a section 1b to which a filet is formed. Accordingly, the oxidation of a section to be brazed is prevented by the silver solder 2 even when the lead pin 1 is taken in trust.</p> |
