发明名称 PRECOATING RESIN APPLICATION ON SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent the corrosion of internal metallic fine wiring, by dissolving precoating resin previously solidified in a ring shape approximately equal to the outline of a pellet after temporarily adhering on the fringe of the pellet for covering only the fringe of the pellet. CONSTITUTION:The pellet 3 is fixed on a substrate 1 by solder 2 with the pre- coating regin 9 provided in a ring shape like a picture frame to fit to the outer boundary of the pellet 3 and previously solidified fitted to the pellet 3 for heating at low temperature of the pellet 3 and pre-coating resin 9. Then, the pre- coating resin 9 is softened to adhere on the fringe 10 of the pellet 3 later to naturally cool for solidified pre-coating resin under a state of covering over the fringe 10 for bonding between an electrode on the pellet 3 and an external take- out lead 4 by an Al fine wire. Thus, since a metallic wire is not contacted on the pre-coating resin, the metallic wire is not fragile with the prevention of disconnection.
申请公布号 JPS57197828(A) 申请公布日期 1982.12.04
申请号 JP19810082773 申请日期 1981.05.29
申请人 SHIN NIPPON DENKI KK 发明人 NARITA KAZUNORI
分类号 H01L21/56;H01L23/28 主分类号 H01L21/56
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