| 摘要 |
PURPOSE:To measure the displacement of a resin sealing region of a lead frame after sealed with resin due to the difference of the displacement of a positioning pin and the thermal expansion of the lead frame by forming a thin deep groove onto the extension of the external-form edge end of the resin sealing region. CONSTITUTION:The grooves, 4, 5, 0.1mm. wide and 0.1mm. deep are shaped onto the external-form extension of the resin sealing region on design of the lead frame 1 and a mold sealing die. Accordingly, the amount of displacement in the longitudinal and lateral directions of the resin sealing region after sealed by a mold. |
