| 摘要 |
PURPOSE:To solder the second lid of an opening previously for the exchange of a poor IC, by providing an opening on the lid welded to welding rings on the fringe of the opening of a package for mount of a hybrid IC. CONSTITUTION:The package 11 for the mount of a hybrid IC, etc. is provided with leads 19 and welding rings 13. Next, a lid body constituted of the first lid 14 provided with an opening 16 having a projection 15 in the center thereof and the second lid 17 previously installed to this opening by solder 18 is loaded with the first lid 14 and welding rings 13 welded for enclosure. When the mounted IC turns poor, the second lid 17 is removed by fusing the solder layer 18 for exchange. |
