| 摘要 |
PURPOSE:To prevent curvatue when stamping with a tie bar joining parts for stamping such as heat sinks of a semiconductor device sealed by resin at the position on the center line of joined parts and reduce stress, by providing grooves, etc. at tie bar cuts after resin sealing. CONSTITUTION:In heat sinks 1, 1', leads 3, etc. fixed to a semiconductor pellet 4 by solder 6 and separated by cutting the tie bar 12 joining parts after sealing by the resin 8, the tie bar 12 is provided on the center line of the joined parts. Thus, the curvature in upper and lower directions generated on stamping the tie bar 12 by the difference between upper and lower stamping amounts of the tie bar is prevented. Besides, the exfoliation of resin by stress on cuttig the tie bar 12 after resin sealing into individual parts is prevented by previously providing grooves 13 in these cuts to reduce stresss. |
