| 摘要 |
PROBLEM TO BE SOLVED: To obtain a phenol resin composition which gives a laminate reduced in warpage and shrinkage by incorporating an initial reaction product obtained by reacting a phenol with formalin, and core-shell particles obtained by coating the surfaces of rubber particles with a heat-resistant resin. SOLUTION: An initial reaction product obtained by reacting a phenol with formalin and core-shell particles (a) obtained by coating the surfaces of rubber particles with a heat-resistant resin are incorporated to obtain the phenol resin composition. The heat-resistant resin in the particles is incompatible with the phenol resin. The particles (a) are preferably used in an amount of 3-30wt.% based on the phenol resin on a solid basis, and have a diameter of perferably 5μm or smaller. When the composition containing the particles (a) in an amount within that range is used to produced an electrical laminate, the laminate is reduced in warpage and shrinkage without detriment to the electrical performances. The particles (a) having a particle diameter not larger than 5μm have satisfactory dispersibility in the phenol resin and are effective in mitigating the stress caused by resin curing.
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