| 摘要 |
In a process for forming a multilayer printed circuit board, in which a multiplicity of printed substrates, as a rule a current source/earth substrate and at least one signal substrate, are laminated one on top of the other to form a laminate structure. A prepreg board is disposed between every pair of adjacent substrates and the laminate structure is uniformly subjected to pressure to prevent the occurrence of cavities and is irradiated with microwave energy to produce heat in the prepreg board, as a result of which the resin contained in the prepreg board is cured. Each substrate may be a body obtained by joining a multiplicity of substrates. The laminate structure can be disposed between a pair of clamping plates which are suitable for transmitting microwave energy. The laminate structure is uniformly pressed and heated by the process mentioned. The process mentioned produces, at low pressure, a multilayer printed circuit board which does not contain any cavities and has a high dispositional accuracy. In addition, according to the invention, the processing time is shortened. <IMAGE> |
