| 摘要 |
PURPOSE:To enhance the protective function of a semiconductor device against the harmful matter of radiant rays, steam, etc., by a method wherein a seal cap consisting of a thin metal, etc., is equipped on the face at least on one side of a plastic package formed by transfer mold. CONSTITUTION:The seal caps 1, 1' consisting of the thin metal, etc., are equipped on both the faces or the face on one side of the plastic package semiconductor device packaged by the molding method of transfer mold. Accordingly the protective function thereof against the harmful matter of radiant rays, steam, etc., invading through the plastic can be intensified remarkably. |
