| 摘要 |
PURPOSE:To contrive to enhance the cooling effect of a high density LSI package by a method wherein a liquid coolant is made to circulate in a connector having metal cylinders to be inserted and to be adhered with pressure mutually with respective input/output pins for an LSI package substrate and a high density printed substrate. CONSTITUTION:The metal cylinder 10 of the plural number are provided to the connector 6 to connect the LSI package substrate 2 mounting LSI's 1 of the plural number and the high density printed substrate 4, the corresponding input/output pins 3, 5 are inserted to be adhered with pressure mutually in the cylinders thereof, and the liquid coolant 9 is made to circulate in the connector thereof to constitute the package. Accordingly because the package is constituted as to cool forcibly heat of the input/output pins with the liquid coolant, generated heat in the LSI's can be radiated effectively. |
