| 摘要 |
PURPOSE:To uniformize the vaporization distribution of a vaporization material by arranging detecting electrodes orthogonal to each other at intervals above a vaporization source, comparing the difference between the detected current values for the respective electrodes with a set value, and controlling the spot position of an electron beam on the vaporization material. CONSTITUTION:An electron beam EB from an electron gun 6 is deflected and projected on the vaporization material 3b in the vaporization source 3 arranged in a vacuum vessel 1 to heat and vaporize the material 3b, the vaporized particles are ionized by an ionization electrode 5 and deposited on a material 4 to be treated, and thin film is formed. In the ion plating device of such a structure, two couples of detecting electrodes 9a-9b and 10a-10b orthogonal to each other are arranged at intervals at about the same height above and close to the vaporization source 3, and a positive voltage with respect to the vaporization source 3 is impressed on the electrodes. The values of the current flowing through the respective couples of detecting electrodes are detected, the difference or ratio between the detected current values is compared with the preset value. A signal is sent from a control signal generator 20 based on the results of the comparison to control the currents passing through the electromagnetic coils 7, 8a, and 8b, and the spot position of the electron beam EB is controlled. |
