| 摘要 |
PURPOSE:To improve and stabilize the flow and joining strength of solder by contg. Ag, Cu, P and In in a specific ratio. CONSTITUTION:This invention relates to Ag solder consisting of 45-75wt% Ag, 12.5-52.5wt% Cu, 0.1-2.5wt% P or further 1-10wt%. In in addition to these. The above-mentioned Ag solder is used for joining electric contact point materials of Ag-oxide type, Ag-Cu type, etc. to a Cu alloy base material. The flow of the solder is good, and the joining strength is high and stable. |
